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通过正确的底部填充，可提高倒装芯片组装的成品率和可靠性。T hen show that correct underfill can dramatically increase thermal reliability.

采用与固化过程相关的粘弹性力学模型描述倒装焊底充胶的力学行为。A cure-dependent viscoelastic model was applied to describe the mechanical behavior of underfill.

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证明了在使用下部填充料后，倒装芯片的热应力可靠性将大大提高。It was found that the application of underfill encapsulation can improve reliability of flip chip significantly.

另外，还研究了下部填充料对倒装芯片封装热应力可靠性的影响。In addition, the impact of underfill properties on thermomechanical reliability of the FCOB assembly was addressed.

这使得完整意义上说，这是其次的图片现代芯片的颠簸和底层指出。This makes complete sense, and it is followed by a picture of a modern chip with the bumps and underfill pointed out.

在有无填胶比较方面，基本上，填胶可以减少塑性应变以及降低其温度。As for with and without underfill , we find that the package with underfill can reduce plastic strain and temperature.

用断裂力学方法和有限元模拟分析了填充不流动胶芯片断裂问题。The die cracking with no-flow underfill is analyzed and compared with the case for conventional capillary-flow underfill.

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工程师可以使用ANSYS工具优化设计、识别和解决涂层和填充材料的影响。Engineers can optimize via design using ANSYS tools, identifying and resolving the effects of coating and underfill materials.

因覆晶封装结构中的矽晶片与有机基板间的热膨胀系数差异颇大，故需填充底胶以确保其长时可靠性。CTE mismatch between silicon and BT board is so colossal that flip chip need filling underfill to keep the long-term reliability.

从热疲劳故障的角度论述了倒装芯片底部填充的必要性，介绍了倒装芯片底部填充的参数控制。Discuss the necessary of flip chip underfill to ther mal fatigue failures. Put forward controlling parameter for flip chip underfill.

通过非线性有限元分析，计算出焊点疲劳寿命对下部填充料基本热力学性质的依赖关系。Through non-linear finite analysis , the dependence of fatigue life of solder joint on thermomechanical properties of underfill was calculated.

文中主要探讨了覆晶封装底胶充填时，锡球、芯片及基板间的流动状况。In this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip and substrate by experiment and 3D mold flow simulation.

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随着移动电子产品的密度越来越高，底层填充技术逐步提高，越来越多的底层填充材料被研发。As the density for mobile electronic product becomes higher and higher and underfill technology improved, more and more underfill material have been developed.

加厚部分充型不良。由于金属流动不充分，未能完全充满加厚模以获得所需的形状而引起的加厚部分外表面或内表面上的凹陷处。Upset Underfill . A depression on the outside or inside of an upset caused by insufficient flow of metal to completely fill out the upset to the desired shape.

它能形成一致和无缺陷的底部填充层，能有效降低由于硅芯片与基板之间的总体温度膨胀特性不匹配或外力造成的冲击。It provides a uniform and void free underfill layer, which gives excellent protection of printed circuit boards from soldering failure due to impact and thermal cycling.

为避免覆晶封装结构中使用底胶填充之限制，且同时保有良好的可靠性，本文提出无底胶附加限制层覆晶封装结构的新概念。For avoiding the disadvantage of filling the underfill and keeping good reliability, this research proposes a novel concept of no underfill with constraint layer flip chip package.

使用寿命是指底部填充剂从冷冻条件下取出后可有效使用的时间。有效使用是指在一定的点胶速度下可保证的点胶量的连续性及一致性。Pot life is the useful life of an underfill encapsulant after it is removed from the freezer and thawed, typically determined by the ability to dispense uniform quantities at uniform speeds.