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分片和重组。Segmentation and reassembly.

转换机制必须能够处理IP分片。Translation mechanisms must handle IP fragmentation.

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原子单元中的所有记录都会存储在相同的分片上。All records in an atomic unit are stored in the same shard.

现在我们定义应用程序中要使用的分片策略。Now we define the shard strategies to be used in the application.

实现特定于应用程序的分片策略的界面。Interfaces for implementing application-specific sharding strategy.

对虚拟碎片的支持，用于缓和与重新分片相关的重负。Support for virtual shards to ease the pain associated with resharding.

您也会得到关于分片和数据包顺序的信息。You will also get information about the fragmentation and packet sequence.

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构造的曲面是分片双三次有理参数多项式曲面。This surface is a piecewise bi-cubic rational parametric polynomial surface.

远望谷将采取分片、分段逐步实施的方案。Yuanwang piecewise Valley will be taken, step by step implementation of sub-programs.

最后对实现过程中遇到的IP分片、ICMP和PMTU问题提出了一套有效的解决方案。At last, effective solutions for difficulties on IP fragment, ICMP and PMTU are provided.

上面描述的分片引擎使用应用程序提供的分片策略。The sharding engine described above uses the sharding strategy provided by the application.

探讨一种求解非光滑优化特殊问题-分片光滑问题的算法。A new method is obtained for a special non differentiable problem-piecewise smooth optimization.

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提出了管片式散热器芯子自动装配中的自动分片原理和方法。The principle and method of plate auto separation in the assemble of radiator core are proposed.

服装各个部位都采用切口和分片，以显露出里面不同颜色不同面料的宽松衬衣。All articles of clothing were slashed and paned , revealing puffs of contrasting fabric and color.

目前，所有的分片功能都是通过ADO.NET在应用级别实现的。At this time all sharding capabilities must be implemented at the application level using ADO.NET.

关键的变更包括新增Journaling日志、提升分片性能以及Shell的Tab​补全。Key changes include the addition of journaling, sharding performance boosts, and shell tab completion.

本实用新型是一种玻璃或其它易碎、易损薄板的分片输送器。The utility model discloses a laminate conveyor used for glass or other frangible and wearable sheets.

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用间断分片可微的函数来近似未知位移场。The unknown displacement field is approximated by discontinuous , piecewisely differentiable functions.

利用本程序对实测频高图既可作分片处理也可作模式换算。Using this program, both lamination reduction and model reduction of the observed ionograms can be made.

集成电路圆片级测试探卡主要应用于分片封装前对芯片电学性能进行初测。Wafer-level IC test probe card is mainly used in the test of chip's electric characters before packaging.