Please help us improve the quality of example sentences! Edit on Github

这个过程被称作重排版。This process is known as a reflow.

适应再流焊与波峰焊。Suit for reflow and wave flow solder.

Other words in sentence

适应再流焊和波峰焊。Available for reflow soldering and wave soldering.

请遵守产品目录中的回流焊条件。Please follow "Reflow Soldering Conditions" in catalogue.

这意味着既回流焊和波峰焊使用。That means both reflow soldering and wave soldering are used.

良好的管理为回流焊和波峰焊温度曲线及温度曲线量测板。Good management for reflow and wave profile and profile board.

红外线和汽相回流焊工艺兼容。Compatible with infrared and vapor phase reflow solder process.

Other words in sentence

最明显的是,使用无铅锡膏必须提高回流焊温度。The most obvious is the necessity for increased reflow temperature.

广泛应用于线材的热压焊、焊锡焊接的回流焊,IC贴片。HOT BARThe hot wire is widely used in welding, solder reflow soldering.

形成了一个平顶使其成为自动贴装和回流合适。Forms a flat top making them suitable for automatic placement and reflow.

优良的可焊性及耐热冲击性,适合波峰焊及回流焊。Superior solder ability and resistance to soldering heat, ldeal for wave or reflow soldering.

小芯片部件在利用焊膏进行回流焊时会出现“翘曲”现象。Small chip components may have "tombstone" problems during reflow process by the solder paste.

Other words in sentence

正如前面所提到的,当布局和几何改变时需要重排版。在下述情况中会发生重排版。As mentioned earlier, a reflow is needed whenever layout and geometry change. This happens when.

回流焊的运动部分包括链轮、网带、宽窄调节、启盖等。The moving parts of reflow welder include the chain wheel, mesh belt, wideness adjuster and cover.

经过回流焊并冷却至室温后,电容器的特性符合下表的要求。After reflow soldering and restored at room temperature, they meet the characteristics listed below.

根据插件焊接质量的要求,按照回流焊工艺设计印刷模板。Design stencil according to requirement of inserter soldering quality and reflow soldering technology.

符合无铅化回流焊接条件,具有耐高温性。The product has good heat durability that withstands lead-free compatible reflow soldering conditions.

Other words in sentence

伪类可能会使元素的样式有些改变,但是此时浏览器不需要重新加载当前显示的文档。User agents are not required to reflow a currently displayed document due to pseudo-class transitions.

着重研究了光刻胶的前烘胶温度、回流温度、回流时间对回流效果的影响。The impact of prebake temperature, reflow temperature and reflow time on the effect of PR reflowing is studied.

回流焊输出之板是否至少抽样检查板的置件精度,有无少件和不良焊点?。Are outputted boards at least sample inspected pre reflow for placement, missing components, and solder defects?